Sponsored by Education Committee
Chair: Patrick DeRoy, Analog Devices Inc.
Co-Chair: Matt Juszczyk, Rockwell Collins Aerospace & Electronics Inc.
Location: Coronado A

Time: 8:30 AM – 5:00 PM

Abstract: This tutorial is an overview of many of the major topics that need to be considered when designing an electronic product or system to meet signal and power integrity (SIPI) and electromagnetic compatibility (EMC) requirements. The tutorial will present the foundational ideas from physics and mathematics and will demonstrate the engineering approaches to help the attendees to successfully design, evaluate, diagnose, and/ or solve EMI problems. The main objective of this tutorial is to provide a learning opportunity for those that are new to EMC as well as provide a review of the basics to those who already have some experience in this area.

Sponsored by TC-9 Computational Electromagnetics
Chair: Bruce Archambeault, Missouri University of Science and Technology
Location: Cortez D
Time: 8:30 AM – 12:00 PM

Abstract: This tutorial will focus on the various simulation techniques, how they work, their strengths and weaknesses. The popular techniques of Finite-Difference Time-Domain (FDTD), Method of Moments (MoM), the Finite Element Method (FEM), and the Partial Element Equivalent Circuit technique will all be discussed with a focus on simulation in the real-world.

Sponsored by TC-2 EMC Measurements
Chair: Monrad Monsen, Oracle
Location: Cortez D

Time: 1:30 PM – 5:00 PM

Abstract: There continues to be those entering the EMC field who are performing measurement activity for both emissions and immunity. In addition, there are practitioners who want to get a second opinion to support what they are doing. They are all at least familiar with basic EMC immunity measurements methods that cover a wide range of electromagnetic phenomena. This tutorial will cover both emissions and immunity by highlighting the latest amendment to a major multimedia emissions standard and a selection of immunity testing standards for transients that are more difficult to implement. The transient discussion will also delve into signals that are high power in a very short time. Also included: a description of emission and immunity test sites, the sites that are becoming popular and their validation requirements, as well as an overview of test setups in these facilities.

Chair: Min Zhang, Mach One Design EMC
Co-Chair: Kenneth Wyatt, Wyatt Technical Services LLC
Location: Coronado B

Time: 8:30 AM – 5:00 PM

Abstract: When facing EMC test failures, design engineers are often required to diagnose and troubleshoot EMI issues quickly and effectively. Without a solid understanding of EMC fundamentals, however, EMI troubleshooting can become a daunting and time-consuming task. Historically, the specialised equipment needed for this work demanded significant financial investment—manageable for large, established companies but often prohibitive for small or early-stage startups.



Recent advances in test and diagnostic technologies have changed this landscape. Engineers can now access highly capable troubleshooting tools at much lower cost, making effective EMI diagnostics more accessible than ever. Yet, the core challenge remains: How do we troubleshoot EMI efficiently? In other words, how do we rapidly identify the root cause of emissions, or pinpoint weaknesses that lead to immunity and susceptibility failures?



This workshop brings together leading global experts to present advanced, practical, and field-proven EMI troubleshooting techniques applicable to emissions, immunity/susceptibility, and transient issues. Attendees will gain valuable hands-on insights, including:



Approaches for quickly identifying noise sources


• Practical diagnostic workflows

• Techniques for low-noise design and noise mitigation

• Troubleshooting methods applicable to PCBs, cables, enclosures, and large systems



These techniques are novel, unique, and validated through years of real-world engineering work by recognised specialists. Whether you work in commercial, industrial, medical, defence, or space electronics, you will find the methods presented in this workshop directly applicable and highly impactful.

Chair: Vignesh Rajamani, Rohde & Schwarz USA, Inc.
Location: Cortez B

Time: 1:30 PM – 5:00 PM

Abstract: This tutorial will introduce recent applications of reverberation chambers. It is intended to provide EMC engineers who are interested in applying reverberation chambers to various measurement issues and the extension of reverberation chambers to solve a variety of EMC problems.


This half-day tutorial provides a brief overview of Reverb Chamber (RC) theory, followed by recent applications of RCs. The tutorial material will be updated to reflect recent research results and implications. The format will be a conference presentation style (lecture) followed by questions moderated by the chairman. It is designed for both academics and people from industry who will be involved in radiated emission or immunity testing of commercial or military systems using reverberation chambers and will be valuable to personnel evaluating the use of reverberation chambers as a complement to or replacement for other types of radiated test facilities and for personnel who are trying to use statistical methods to characterize the electromagnetic environments.

Chair: Vignesh Rajamani, Rohde & Schwarz USA, Inc.
Co-Chair: Niek Moonen, Universiteit Twente
Location: Cortez C

Time: 8:30 AM – 12:00 PM

Abstract: As SiC and GaN devices become increasingly prevalent in modern electronics, their fast-switching behavior introduces new electromagnetic compatibility (EMC) challenges at both inter- and intra-system levels. Beyond adhering to design rules, there is a growing need to investigate and understand the resulting electromagnetic interference (EMI). This workshop equips participants with the knowledge to link design choices to their EMI impact and to select appropriate measurement instruments and accessories for effective EMI analysis and qualification of power electronic devices and circuits.

Sponsored by TC-3 Electromagnetic Environment
Chair: Carl Hager, NSWC Dahlgren
Co-Chair: Finbarr O’Connor, Huntington Ingalls Industries Inc
Location: Cortez A

Time: 8:30 AM – 5:00 PM

Abstract: Achieving electromagnetic compatibility with military equipment, systems, and platforms requires significant expertise and effort. EMC must be considered at all lifecycle stages and involves first characterizing the operational electromagnetic environment (EME), then design/testing military systems at various stages of production, assembly and integration and coordination of Spectrum in operational environments. Numerous Military EMC standards and handbooks have been developed for electromagnetic environmental effects (E3) measurements and analysis to reduce the risk of equipment and systems failing to meet their operational performance requirements due to detrimental E3. The tutorial will focus on various considerations for Military EMC applications including Electromagnetic Interference (EMI), Electrostatic Discharge (ESD), Hazards of Electromagnetic Radiation to Ordnance (HERO), Electromagnetic Pulse (EMP), Lighting, Spectrum Sharing, etc.



The objective of this tutorial is to enhance our attendees’ knowledge and understanding of key aspects of Military EMC that will help them in the performance of their jobs. The tutorial will cover a broad range of Military EMC topics. The first half of the morning session will consist of three requirements-based presentations, and the afternoon session consists of four EMC Testing and Measurements topics.

Sponsored by TC-8 Aeronautics and Space EMC
Chair: Phillip Miller, RATLR
Co-Chair: Nika Amralah, Department of National Defence
Location: Coronado D

Time: 8:30 AM – 5:00 PM

Abstract: Transmogrification is the act of changing into a different form or appearance (especially a fantastic one), such as from a frog into a prince. The purpose of this workshop is to present tools, skills, and techniques from Sr EMC Engineers in the Space and Military Segment to the next generation of EMC Engineers.

Sponsored by TC-1 EMC Management
Chair: Henry Benitez, University of Portland College of Arts and Sciences
Location: Coronado C

Time: 8:30 AM – 5:00 PM

Abstract: This workshop will address global electromagnetic regulations, standards, and product compliance activities. Representatives and experts will present on topics to include the FCC, TCB’s, FDA, NIST MRA’s and Lab Accreditations. Standards representatives and experts will discuss standards to include CISPR, IEC, ANSI, IEEE and others pertinent for product EMC compliance.

Sponsored by TC-4 Electromagnetic Interference Control
Chair: Charles Jullien, Safran Electrical and Power
Co-Chair: Huadong Li, Molex LLC
Location: Cortez B

Time: 8:30 AM – 12:00 PM

Abstract: This workshop will present the upcoming P2855 standard for characterizing the shielding effectiveness of cable/connector assemblies from DC to 40 GHz. This standard proposes recommended measurement techniques for evaluating and specifying the shielding effectiveness of cable/connector assemblies to control electromagnetic interference (EMI). It thus enables product compliance with current government, regulatory, and customer requirements and ensures the electromagnetic compatibility (EMC) of the system. The standard also provides measurement techniques for evaluating and specifying the shielding capabilities of cable/connector assemblies to reduce electromagnetic energy coupling between these assemblies. Emphasis is placed on measurement techniques already incorporated into, or widely used in, commercial and military standards. A set of new methods to be incorporated into the standard will be presented. The first workshop is divided into topics such as magnetic shielding methods. A second speaker addresses the follow-up to this work and ideas for extending the methods along innovative paths such as the integration of environmental constraints or contact resistances in connectors.



The workshop is divided into topics as; Magnetic shield method, DC method, Triaxial method, Injection line method, Parallel plate method, Localized injection method, Anechoic chamber method, G-TEM cell method, Reverberation chamber, Shielding Effectiveness Measurands, Environmental testing.

The workshop will help the audience to properly test and design cables, connectors and their assemblies for product EMC.

Chair: Garth D’Abreu, ETS-Lindgren
Co-Chair: Robert Kado, Stellantis US
Co-Chair: Craig Fanning, Elite Electronic Engineering, Inc.
Location: Cortez C

Time: 1:30 PM – 5:00 PM

Abstract: Global electric vehicle (EV) sales continues its upward trend with regional differences in growth rate across Asia, Europe, and the Americas, and as manufacturers continue to develop the advanced features that we have all become accustomed to, the challenges for the EMC test engineers remain as prevalent as ever. Advanced driver assistance systems (ADAS), automated driving systems (ADS) and autonomy are terms synonymous with sophisticated levels of sensor integration and computer control in the automotive industry, but many of these features are common to other vehicles under the classifications of drones, electric vertical takeoff and landing (eVTOL) vehicles, and others that have become increasingly popular. Although there are new standards and guidance documents published and others in development to help users navigate the increasingly extensive test scope associated with the broad umbrella of vehicles, some serve a regulatory purpose, and others introduce initiatives to help improve the reliability and efficiency of tests, applicable across multiple platforms.



In this tutorial, speakers will provide an update on the latest development in the automotive EMC standards, look at other standards and their use for other types of vehicles, and discuss options and other initiatives under consideration. We will also hear from manufacturers on the challenges that they face, and solutions that test equipment manufacturers are working on to help manufacturers meet their performance goals.



Our speakers have extensive experience in automotive EMC/RF/Wireless design and test, with some active technical contributors to international standards committees including IEEE, ISO, SAE, and CISPR.

Sponsored by Education Committee
Co-Chair: John McCloskey, EMC-Closkey
Co-Chair: Vignesh Rajamani, Rohde & Schwarz USA, Inc.
Co-Chair: Patrick Andre, Andre Consulting, Inc.
Location: Cortez B

Time: 1:30 PM – 5:00 PM

Abstract: EMI/EMC testing is crucial for ensuring that electronic devices perform reliably in their intended electromagnetic environment and don’t interfere with other devices. Tests must be optimized to improve efficiency and reduce cost. Most importantly, the test engineer must have a thorough understanding of the test equipment and its capabilities is essential in order to ensure the robustness of the testing process and reliability of the results. In this half-day workshop, we will cover some fundamental concepts of testing accompanied by live demonstrations showcasing proper usage of oscilloscopes, spectrum analyzers, EMI receivers, and vector network analyzers (VNAs) for EMC measurements and debugging.

This workshop is proposed for a half day, divided into two 90-minute sessions separated by the afternoon break. The first 90-minute session will consist of a theoretical discussion of test and measurement concepts; the second 90-minute session will consist of hands-on demonstrations to provide a deeper understanding.


Sponsored by TC-8 Aeronautics and Space EMC
Chair: Carlos Aviles, Northrop Grumman Corp
Co-Chair: Nika Amralah, Department of National Defence
Location: Coronado A
Time: 1:30 PM – 5:00 PM

Abstract: This workshop discusses topics in Aerospace EMC, including design, development, and test for airplanes, helicopters, missiles, and spacecraft.

Sponsored by TC-9 Computational Electromagnetics
Co-Chair: Patrick DeRoy, Analog Devices Inc.
Co-Chair: Scott Piper, Dassault Systemes Americas Corp
Co-Chair: Bruce Archambeault, Missouri University of Science and Technology
Location: Cortez A
Time: 1:30 PM – 5:00 PM

Abstract: This tutorial will expose the attendees to the lessons learned by a number of industry experts over the years. The goal being that the attendees will benefit from the, sometimes painful, learning experiences of the presenters. Computational tools are very powerful and simulation is invaluable to the modern design engineer but there is still an art to using these tools effectively. In all disciplines, hindsight is perfect and the opportunity to learn from others is a valuable resource. This tutorial will not only show lessons learned but also expose the attendees to fundamental ways of thinking through their models to better ensure success. Examples relevant for Signal Integrity, Power Integrity and Electromagnetic Compatibility design will be shared. The critical subject of Validation is covered, considering the full spectrum of electronics modeling and simulation from SPICE to 3D full-wave, to co-simulations. The approaches one can take with modern simulation tools, from fast 2D pre-layout simulations to full 3D “Virtual Twin” simulations (when appropriate) will also be discussed. Experiences in applying EM simulation tools for gaining insights into real-life shielding challenges will be covered. In addition, lessons learned correlating measurements and simulations will be discussed, with an emphasis on balancing the strengths and weaknesses of each.

Sponsored by SC-3 Special Committee on Machine Learning and Artificial Intelligence in EMC and SIPI
Chair: Lijun Jiang, Missouri University of Science and Technology
Co-Chair: Alistair Duffy, De Montfort University
Co-Chair: Hanzhi Ma, Zhejiang University
Location: Cortez C
Time: 1:30 PM – 5:00 PM

Abstract: Machine learning is profoundly impacting the landscape of every technology domain, including signal integrity, power integrity, EMC, and EMI engineering. This tutorial is for entry-level audiences who are interested in machine learning. The topics in this tutorial will practically guide audiences through the fundamentals of machine learning methods, resources needed for using machine learning methods, and successful application examples for EMC society. The invited speakers are frontier experts who have practical experience in machine learning method development and applications. This tutorial will aim to draw broader attention and guide hands-on experiences of machine learning for EMC/EMI, SI and PI technologies. This special session is sponsored by IEEE EMC Special Committee SC3 “Machine Learning and Artificial Intelligence in EMC and SIPI” and welcomes audiences from all IEEE EMC Technical Committees.

Sponsored by TC-5 High Power Electromagnetics
Chair: Akiyoshi Tatematsu, Central Research Institute of Electric Power Industry
Co-Chair
: Fernando Silveira, Universidade Federal de Minas Gerais
Location: Coronado D
Time: 1:30 PM – 5:00 PM

Abstract: Lightning strikes may cause damage of power equipment and malfunction of electronic devices, and numerical analysis is essential for predicting transient phenomena and designing effective countermeasures to suppress overvoltages and prevent failures and disturbances of power equipment and electronic devices. This workshop will provide a comprehensive overview of recent advances in numerical transient analysis for lightning phenomena in power systems and related facilities. The objectives are (i) to present cutting-edge full-wave and circuit-theory-based simulation methodologies for lightning transients, (ii) to illustrate their applications to real-scale power transmission, distribution, and renewable-energy installations, and (iii) to highlight emerging techniques that enhance modeling accuracy, computational efficiency, and practical engineering applicability.

Sponsored by TC-8 Aeronautics and Space EMC
Chair: Fred Heather, Naval Air Systems Command
Location: Coronado C
Time: 1:30 PM – 5:00 PM

Abstract: Prior to integrating any electronics component into a larger system, it is highly desirable to assess its performance under environmental conditions that are representative of those that may be encountered during its operation in the larger system. For any given family of platforms, a standardized test approach ensures that such tests are controlled, reliable, and repeatable while minimizing the risk of potential problems at integrated system level.


This workshop discusses the following EMC test standards used in aerospace applications:


• P2838™/D20: Standard for Aerospace Vehicle Component Lightning Strike Direct Effects Qualification

• RTCA DO-160: Environmental Conditions and Test Procedures for Airborne Equipment

• SAE AE-4 EMC Standards for Aircraft

• ANSI C63.25 Working Groups are submitting their draft standards for characterizing Semi-Anechoic Chambers (SAC), Reverb Chambers (RC), and Compact Antenna Test Ranges (CATR) for the frequency range from 18-40GHz. Unlike previous standards, these will include multiple methods for labs to balance time, equipment cost, and precision of their measurement. This talk will discuss the coming standards, the trade-offs in the methods, and the technology available to achieve the most appropriate data set for commercial and private labs.

• ANSI C63.25 Standards for Characterizing Semi-Anechoic Chambers (SAC), Reverb Chambers (RC), and Compact Antenna Test Ranges (CATR)

• MIL-STD-461: Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment

• AIAA S-121: Electromagnetic Compatibility Requirements for Space Equipment and Systems
 SSC-T-008: Space Force Lightning Requirements

Chair: Janet O’Neil, ETS-Lindgren
Co-Chair
: Dennis Lewis, The Boeing Company
Location: Coronado B
Time: 1:30 PM – 5:00 PM

Abstract: This tutorial will present detailed information about the state of the art in calibration of EMC measurement equipment and test facilities required by many current international standards. Specific requirements and nuances that can challenge even the most experienced EMC practitioner will be discussed, and methods for practical implementation for real-world application will be shared with attendees. Speakers will include experts who are actively involved in using, writing and maintaining the standards in which the requirements are established. Material will be presented, representing activity within the related standards committees, including CISPR, ISO, ANSC C63® and IEEE. This tutorial will take a novel approach to equipment and facility calibration by delving into implementation of specific characteristics and requirements, as opposed to a general treatment of calibration. Calibration issues related to a variety of test facilities and measurement equipment and the associated standards will be included, including antennas per ANSI C63.5; field probes according to IEEE 1309; test sites used for antenna calibration and reference test sites, per revision being developed for CISPR 16-1-5 and future CISPR 16-1-6, C63.25.3. A new method will be shared that allows a more accurate and convenient method for LISN calibrations using a VNA.



Attendees can expect to improve their understanding of both the background of the latest requirements for calibration of EMC measurement equipment and facilities and practical aspects of performing or specifying the required calibrations.

Chair: Andreas Hardock, Nexperia
Co-Chair: Sergej Bub, Nexperia BV
Location: Cortez D
Time: 1:30 PM – 5:00 PM

Abstract: Driven by the growing demand for high data processing, new high-speed interfaces are increasingly being adopted in the automotive industry, including Automotive SerDes (ASA) and Ethernet with data rates of 2.5 Gbps, 5 Gbps, and 10 Gbps. Automotive Ethernet, in particular, has gained significant traction since the introduction of 100BASE-T1 and 1000BASE-T1 in 2016. Today, Ethernet data rates beyond 10 Gbps are already being discussed for future automotive applications.

Sponsored by TC-4 Electromagnetic Interference Control
Chair: Lirim Koraqi, Katholieke Universiteit Leuven
Co-Chair
: Pavithrakrishnan Radhakrishnan, Oklahoma State University
Location: Cortez D
Time: 8:30 AM – 12:00 PM

Abstract: The increasing integration of power electronics, high-speed digital systems, sensors, and communication technologies in modern engineering applications is intensifying electromagnetic interference (EMI) challenges across a wide frequency range. From low-frequency (LF) magnetic fields generated by power conversion systems to high-frequency (HF) radiated emissions affecting sensitive electronics, electromagnetic disturbances pose growing risks to system performance, reliability, and safety. As electronic systems become increasingly compact and functionally dense, electromagnetic shielding has become a critical design element for ensuring electromagnetic compatibility (EMC) across a wide range of applications, including transportation, industrial automation, aerospace, and medical systems.



This tutorial provides a unified perspective on electromagnetic shielding in modern electronic systems. It addresses the optimization of shielding in complex, highly integrated platforms by examining EMC challenges and practical design strategies. Widely used shielding elements, such as cables, are discussed with emphasis on how shielding effectiveness (SE) is characterized in practice and how the measurement setup influences the resulting SE values. The tutorial further addresses the challenges of reliably characterizing LF magnetic shielding under near-field conditions, the use of electromagnetic absorber materials to enhance enclosure-level shielding, and an overview of relevant shielding standards and their role in ensuring reliable and reproducible characterization. Active EMI mitigation techniques applicable to such systems are also introduced, thereby completing the link between shielding design, characterization, and standards across a broad range of applications. In addition, the integration of the Safe-and-Sustainable-by-Design (SSbD) approach into shielding solutions is discussed, focusing on key factors such as electromagnetic safety, weight, volume, mechanical strength, and cost.



The tutorial also presents contributions from the Doctoral Network (DN) PARASOL project, funded by the Marie Skłodowska-Curie Actions (MSCA) under the Horizon Europe (HE) framework. These contributions illustrate a multidisciplinary approach that integrates EMC materials engineering, system safety engineering, and SSbD principles in the development of electromagnetic shielding solutions.

Chair: Satoru Kuramochi, Dainippon Insatsu Kabushiki Kaisha
Location: Cortez C
Time: 1:30 PM – 5:00 PM

Abstract: This workshop focuses on signal and power integrity challenges in heterogeneous AI server packages using glass substrates. As high-speed SERDES PCIe links are required to operate well into the tens of gigahertz, the choice of interconnect structure becomes a critical design factor.

A comparative study using insertion loss data up to 40 GHz is presented for metallized through-glass vias (TGVs) and GSG coplanar transmission line structures. The results illustrate the impact of glass substrate architecture on high-speed signal transmission and highlight key differences between Glass Core Substrate and Glass Interposer approaches. Through practical comparison and discussion, participants will gain insight into SI trade-offs, interconnect selection, and package-level design considerations for energy-efficient AI server systems with co-packaged optics.

Sponsored by TC-7 & TC-8 Electrical System and Power Electronics EMC (formally Low Frequency EMC) & Aeronautics and Space EMC)
Chair: Cong Li, GE Aerospace

Co-Chair: Niek Moonen, Universiteit Twente
Location: Coronado C
Time: 8:30 AM – 5:00 PM

Abstract: This EMC tutorial is part of the IEEE EMC Society REACHES (Roadmap for EMC in Aerospace High-voltage Electrical Systems) initiative, jointly sponsored by IEEE EMCS TC7 (Electrical System and Power Electronics EMC) and TC8 (Aeronautics and Space EMC).



As the aviation industry transitions toward More Electric Aircraft (MEA) and hybrid-electric propulsion, the integration of high-voltage (HV) systems introduces unprecedented Electromagnetic Compatibility (EMC) challenges. Driven by the urgent need to reduce atmospheric emissions, these propulsion technologies demand significantly higher power levels. This shift necessitates optimal source placement and energy management, alongside the optimization of wiring harnesses to maintain system efficiency. Increased currents and voltages directly impact cable sizing, insulation, and connection systems—factors that significantly increase overall system mass and generate higher radiated electromagnetic fields that pose risks to sensitive equipment.



This tutorial provides a comprehensive examination of lessons learned from recent aviation electrification projects. It addresses critical issues such as high-speed switching noise from motor controllers, HV cable insulation degradation, and the evolving requirements of RTCA DO-160G (and the upcoming DO-160H) and MIL-STD-461G for HV architectures. Attendees will gain insights into advanced filtering, shielding strategies, and the emerging capabilities required of modern EMC test labs to validate these high-power systems. By bridging the gap between theoretical EMC principles and practical airframer experiences, this session offers a roadmap for achieving airworthiness in the next generation of electrified flight.

Chair: Susanna Mosleh, National Institute of Standards and Technology
Co-Chair: Mohamad Omar Al Kalaa, Inovectrum
Location: Coronado B
Time: 8:30 AM – 12:00 PM

Abstract: Emerging 5G deployments are changing the RF environment in which medical devices operate and, in some cases, exposing them to new coexistence and electromagnetic compatibility (EMC) issues that are not well covered by common immunity and wireless coexistence verification profiles. As hospitals roll out private cellular, indoor small cells, distributed antenna systems, and new 5G-enabled workflows, medical equipment may operate in denser, more dynamic spectra and be even closer to emitters than many legacy assumptions reflect. This workshop ties what’s being deployed in and around hospitals to the failure mechanisms we may observe when testing and debugging devices, with an emphasis on building test setups that are repeatable in the lab and still representative of clinical use. The workshop will also address emerging 5G connectivity paths used for remote and mobile care and what they imply for coexistence, immunity testing, and compliance evidence.



We will bring together medical device EMC/coexistence engineers, test labs, wireless and system engineers, device manufacturers, and regulators for a technical discussion of what is changing, where failures tend to hide, and how to validate robustness without over-testing or chasing unrealistic cases.


Sponsored by TC-11 & TC-8 Nanotechnology and Advanced Materials & Aeronautics and Space EMC
Chair: Marina Koledintseva, The Boeing Company, Saint Louis, MO
Co-Chair: Nika Amralah, Department of National Defence
Location: Coronado D
Time: 8:30 AM – 5:00 PM

Abstract: Currently, there is a lot of interest in design and application of nanomaterials and various advanced materials for aerospace technology. These materials allow for solving numerous problems in Aerospace Engineering, including electromagnetic interference (EMI) control, electromagnetic compatibility (EMC) at the system level, and protection against various electromagnetic environmental effects (E3). In this Workshop, presentations will focus on physics, technology, characterization, and EMI/EMC/E3 applications of new advanced materials, including nanomaterials, metamaterials, advanced magnetic materials, and various composites. Such novel materials with advanced electromagnetic, mechanical, thermal and other important for aerospace engineering properties are perspective for design of EMI shielding and filtering structures, as well as various electromagnetic wave absorbers.

Chair: Rajen Murugan, Texas Instruments, Inc.
Co-Chair: Dipanjan Gope, Simyog Technology
Location: Cortez C
Time: 8:30 AM – 12:00 PM

Abstract: EMI/EMC issues drive approximately 30% of verification-stage failures, representing billions in lost revenue across the electronics industry. The traditional compliance approach—building physical prototypes for laboratory testing—creates expensive re-design cycles, market delays, and significant business risk. Progressive semiconductor companies are now leveraging simulation-based methods to identify and resolve EMC issues early in the integrated circuit product design process.

This tutorial delivers a proven simulation and diagnosis framework for achieving first-pass EMI/EMC compliance while minimizing system-level failures. Core topics include:


• Conducted Emission (CISPR25 CE Voltage and Current Method)

• Radiated Emission (CISPR25 RE)

• Bulk Current Injection (ISO-11452-4 open and closed-loop)

• Radiated Immunity (ISO-11452-2)


Sponsored by TC-9 Computational Electromagnetics
Chair: Feng Ling, Xpeedic
Co-Chair: Vladimir Okhmatovski, University of Manitoba
Location: Coronado A
Time: 8:30 AM – 12:00 PM

Abstract: The rapid adoption of 2.5D/3D integration, chiplet-based architectures, and advanced packaging technologies has fundamentally transformed the landscape of signal integrity (SI), power integrity (PI), and electromagnetic compatibility (EMC). The introduction of dense interposers, through-silicon vias (TSVs), micro-bumps, high-bandwidth memory (HBM), and ultra-short die-to-die interconnects has pushed electromagnetic interactions into regimes where traditional modeling assumptions and design abstractions are no longer adequate.

Addressing these emerging challenges increasingly requires advanced computational electromagnetics (CEM) methods that are both rigorous and scalable, capable of handling large, multi-scale, and multi-physics systems while remaining compatible with practical design workflows. Recent progress in full-wave solvers, fast algorithms, domain decomposition, and model order reduction has opened new opportunities to bridge fundamental EM theory with system-level SI/PI analysis in complex multi-die environments.

This workshop brings together leading researchers from academia (University of Manitoba, Ghent University, Missouri University of Science and Technology) and experts from industry (Intel) as well as EDA tool developers (Cadence, Xpeedic, CEMWorks) to present and discuss recent advances in computational electromagnetics and their applications to signal and power integrity analysis of multi-die 2.5D/3D IC packages. Topics will span from numerical methods and modeling techniques to real-world design case studies, with an emphasis on translating EM rigor into actionable engineering insight. The workshop aims to foster cross-disciplinary dialogue and to identify open challenges and future research directions at the intersection of computational EM, SI/PI, and advanced system integration.

Sponsored by TC-9 Computational Electromagnetics
Chair: Giorgi Maghlakelidze, NVIDIA Corp
Co-Chair: Yansheng Wang, Meta Platforms Inc
Location: Cortez A
Time: 8:30 AM – 5:00 PM

Abstract: Open source could transform how the SIPI/EMC community collaborates, innovates, and solves design challenges. From Linux to RISC-V to much of AI development, open-source projects have proven that community-driven development delivers powerful, flexible, and cost-effective solutions. But what does this mean for signal and power integrity engineers?



This workshop explores why open-source matters for our field: community support ensures you’re never solving problems alone; free tools lower barriers to entry; customization lets you extend standard offerings to meet specific needs; and broader participation drives ecosystem growth and standardization. Now in its third year, this workshop brings together maintainers, contributors, and users of open-source SIPI/EMC projects to showcase new tools and share practical insights: What motivates creators to open-source their work? How do you sustain a contributor community? How do these tools improve real-world designs?


Attendees will discover tools they can apply immediately, gain inspiration to launch their own projects, and learn how to become effective contributors.

Chair: Michael Hill, Intel
Co-Chair: Vladimir Okhmatovski, University of Manitoba
Location: Coronado A
Time: 1:30 PM – 5:00 PM

Abstract: Tutorial features talks on current initiatives to form benchmarks for characterization of electronic packages. Six available benchmarks representing typical cases for signal and power integrity analysis and varying in complexity from simple microstrip line to a full package model are intended to serve as standardized cases for testing performance and accuracy of the modeling tools are discussed with emphasis on two latest benchmarks. While the benchmarks consisting of CAD model files as well as simulated and measured network parameters are publicly available and described in the accompanying manual, the emphasis in this tutoria is made on challenges encountered in creating measured data, development of modeling capabilities in the computational tools essential for accurate and expedient electromagnetic analysis of the benchmarks, and common practices going into matching of the simulated to measured data. Ongoing efforts towards standardization of densely packed interconnects for die-to-die interfacing on advanced packages also known as heterogeneous integration are also addressed.

Chair: Grant Schmidbauer, British Columbia Institute of Technology
Location: Cortez B
Time: 8:30 AM – 12:00 PM

Abstract: The goal of most companies is not to only design products to be safe, perform according to customer demands, and to meet regulatory requirements, it is to sell those products globally. While your product must comply with the EMC and SIPI requirements, there are a myriad of other technical requirement that must also be considered to facilitate the sale of the product.



The plan for this tutorial is to delve into some of the “other technical requirements” that products must comply with, including product safety requirements (ie, concepts such as fire, shock, mechanical, temperature, and radiation); and then once your products are compliant, we will discuss the commercialization of the product through obtaining the many country approvals that are needed in order to legally sell the product around the world.



This tutorial should be attended by product realization managers, design engineers, test technicians, product regulatory personnel, project managers, marketing personnel, and others interested in learning more about product safety and global market access requirements.

Chair: Martin Wiles, MVG World
Location: Coronado B
Time: 1:30 PM – 5:00 PM

Abstract: This workshop on Automotive EMC covers a wide range of relevant topics on EMC for Electric Vehicles from simulation, measurement good practice and test implementation.