Speaker: Bill Koerner, Keysight Technologies, Inc.
Location: E&D Booth 1
Time: 10:00 AM – 12:00 PM

Abstract: As the use of connected medical devices and internet of things (IoT) devices continue to increase, the challenges associated with regulatory compliance testing also increases. With higher speed chips, switching power supplies, cramped circuit layout, the EMC challenges can increase, and shift higher in frequency. Furthermore, the growing use of connected medical devices in mission-critical applications (operating rooms, remote health, implanted devices) means that the consequences of poor coexistence are more severe than ever before. It is crucial for medical device manufacturers to guarantee a seamless user experience and reliability of the device operating in environments with numerous competing wireless signals and to comply with ANSI C63.27 standard or guidance. Neglecting to consider unforeseen usage scenarios can expose vulnerabilities in the performance and resilience of the wireless devices. The absence of defined testing parameters and unambiguous pass/fail benchmarks leads to irregular assessment, impeding the efficiency of quality evaluation. In this session, attendees will learn the challenges of wireless regulatory compliance testing, and understand the key guidance and standards associated with wireless coexistence testing, and EMI. Along with that, there is the question of do I need to test the certified module incorporated into my medical device. This presentation will address that, and demonstrate ways to quickly and accurately test the wireless device for compliance. Also new is the concern of cybersecurity of the medical device. The demos will include examples of co-existence testing; regulatory compliance testing for FCC and ETSI standards, and how to conduct cybersecurity testing on medical devices.

Sponsored by TC-9
Speaker: CJ Reddy, Siemens Digital Industries Software Inc
Location: E&D Booth 2
Time: 10:00 AM – 12:00 PM

Abstract: Electromagnetic compatibility (EMC) is a critical part of platform design in the defense industry. Numerical simulation for EMC problems – such as radiation or crosstalk at cable harnesses – can help to identify and analyze potential EMC issues at an early stage and find corrective actions. When designing complex systems, compliance with electromagnetic radiation hazard standards (e.g., ICNIRP 2020) must be ensured. In this demo, we will introduce electromagnetic simulation methods for cable modelling (radiation/irradiation), shielding effectiveness, High Intensity Radiated Fields (HIRF) and Electromagnetic Pulse (EMP). We will also discuss the hazards of electromagnetic radiation to personnel (HERP), ordnance (HERO), and fuel (HERF) and how this can be estimated through numerical simulations.

Speaker: Aaron Lutz, Rohde & Schwarz
Speaker: Leonard Wilson, Rohde & Schwarz
Location: E&D Booth 3
Time: 10:00 AM – 12:00 PM

Abstract: This technical demonstration provides a comprehensive overview of the ISO 11452-9:2021 standard, highlighting critical updates and methodology shifts from the previous 2012 version. The presentation details the essential equipment configurations, calibration requirements, and verification protocols necessary for testing. A practical application of these standards is showcased through a live demonstration featuring RF test equipment and specialized EMC test software, providing attendees with insights into modern electromagnetic immunity testing.

Sponsored by TC-5
Speaker: Christophor Hillyard, Navy MWR Naval Air Station Patuxent River
Speaker: Tiffany Morisak, Naval Air Systems Command
Speaker: Michael Stone, Naval Air Warfare Center Aircraft Division
Location: E&D Booth 4
Time: 10:00 AM – 12:00 PM

Abstract: This approach will also allow us to emphasize how these tests contribute to E3 design and mitigation strategies for lightning protection.

Sponsored by TC-8
Speaker: John McCloskey, EMC-Closkey
Location: E&D Booth 1
Time: 2:00 PM – 4:00 PM

Abstract: Sooner or later, every EMC engineer will encounter a crosstalk problem. As with any EMC problem, the engineer must properly understand the nature of the coupling in order to provide an effective mitigation strategy. This demonstration will address the two major types of crosstalk, capacitive (electric field) and inductive (magnetic field). You will learn how to distinguish between these two types and how to apply appropriate mitigation strategies for either.

Speaker: Yibo Wang, ETS-Lindgren
Speaker: Zhong Chen, ETS-Lindgren
Location: E&D Booth 2
Time: 2:00 PM – 4:00 PM

Abstract: EMC chamber performance is validated using standardized tests such as Normalized Site Attenuation (NSA), site Voltage Standing Wave Ratio (sVSWR), and Field Uniformity (FU), as defined in ANSI, CISPR, and IEC standards. Meeting requirements such as 4 dB NSA and 6 dB sVSWR can be straightforward with unlimited space and budget, but real projects must balance building constraints, budget limits, quiet zone size, and absorber coverage. Because of these real-world tradeoffs, performance prediction is essential to optimize key design choices such as chamber size, geometry, absorber selection, and test setup. Accurate modeling is the foundation for reliable prediction and efficient design optimization.

This demonstration includes three parts. First, we will provide an overview of the EMC chamber design workflow using simulation-driven optimization and show how accurate simulations help achieve target performance under practical constraints. Second, we will present a case study of a newly built 10 m EMC chamber, including a 3D model and a direct comparison between simulated results and measured validation data. Third, in the same 10 m chamber, we will demonstrate EMC radiated emissions testing using antenna mast solutions and compare their performance, including a linear mast, a fixed-height boresight mast, and a new-generation adjustable-height boresight mast. The demonstration will highlight the advantages of boresight over a linear mast, and the added benefits of adjustable-height boresighting for accurate and repeatable measurements across different test setups.

Speaker: Patrick Mayer, Rohde & Schwarz
Location: E&D Booth 3
Time: 2:00 PM – 4:00 PM

Abstract: This workshop starts with an introduction to the basics of the EMI test receiver. Characteristics, differences to oscilloscopes or spectrum analyzers, as well as important parameters for a successful EMI measurement are highlighted. This serves as a basis for the following topics of the workshop and offers participants with different levels of knowledge the opportunity to attend this workshop. The technological development of EMI measurement technology and the outstanding advantages of modern instruments will be demonstrated. Modern EMI test receivers rely on the Fast Fourier Transform (FFT), which was only made possible by modern signal processing and high computing power. Large bandwidths not only ensure enormous measurement speed improvements, but also increase reliability, repeatability and offers unprecedented possibilities for analyzing the measurement objects. This will be examined in a practical way on the instrument as well as with external automation software. In addition, the workshop shows current measurement methods in practice that highlights the problem of high input levels and solutions to avoid false measurements or even costly damages to the device. The teaching of theory in this workshop is always supported by practical measurements and demonstrations directly on the instrument.

Speaker: Samuel Hildebrandt, LUMILOOP GmbH
Speaker: Lukas Oppermann, LUMILOOP GmbH
Location: E&D Booth 4
Time: 2:00 PM – 4:00 PM

Abstract: The demo session will start with a brief introduction on the basics of reverberation chambers (RCs). Validation, radiated immunity as well as radiated emission testing are discussed.

We will bring a small, but fully working, stirred RC to the stage. Eight fast, synchronized electric-field probes will showcase real-time E-field strength measurements. Closed loop E-field control based on statistics is shown with different chamber loading. In a custom software, the audience can easily understand how the closed-loop control works. A demonstration using commercial EMC test automation software shows that the method is ready for day-to-day use. LUMILOOP’s LSProbe E-field Probes enable accelerated measurements according to ISO 11451-5.

The reverb chamber basics will also be visualized using live measurements, helping to quickly grasp how the invisible electric field behaves.

Learn on how to improve your EMC measurements. Save time and money while having a better test coverage!

Speaker: Gopinath Gampala, Siemens Digital Industries Software Inc., Germany
Speaker: C.J. Reddy, Siemens Digital Industries Software Inc.
Location: E&D Booth 1
Time: 10:00 AM – 12:00 PM

Abstract: Radiated emissions or unwanted electromagnetic radiation is a major concern with any electrical or electronic device. In automotive and aerospace, cars and airplanes have several control units interconnected with cables. Considering the design cycle of an EV car, the wire harness design, the PCBs of the control units, the connectors, etc., are handled by different design groups. A unified workflow to exchange the data between these design groups to identify the EMC/EMI issues in the early design stages would eliminate a lot of re-work. This software demonstration presents such a workflow between Siemens Capital, HyperLynx and Feko. The wire harness designed in Capital Harness Designer can be exported through a special plug-in to the industry standard KBL file. This plug-in allows the cable cross-sections, paths, connectors, shields, bundles, splices, material properties, etc., to be automatically imported into Feko.

This eliminates the need to redefine the automotive harness details in Feko. The ECAD import functionality in Feko allows the PCBs designed in HyperLynx to be imported into Feko keeping the layered stack information intact. The schematic link functionality in Feko allows direct connection between the cable ports on the harness and the geometry ports on the PCB. This digital prototype would empower the engineers to perform an integrated EMC analysis and test various mitigation techniques, like modifying the cable route, changing the shielding parameters, etc. This workflow will be presented at the conference with live examples.

Sponsored by TC-9
Speaker: Paul Bremner, Robust Physics
Location: E&D Booth 2
Time: 10:00 AM – 12:00 PM

Abstract: Reverberation Chamber testing for Radiated Immunity may only require one test – which might be a big time and cost saving over multiple test configurations in the Anechoic chamber. But what is the difference in electric field environments created in each case ? And how to correctly define the statistical limits of reverberation chamber testing, so that they reliably “enclose” the results from multiple Anechoic chamber test conditions ? This session will demonstrate the use of new statistical wave physics SIMULATION software to simply and quickly answer these questions.

Sponsored by TC-3
Speaker: Karen Burnham, EMC United
Location: E&D Booth 3
Time: 10:00 AM – 12:00 PM

Abstract: EMC troubleshooting often does not require the latest and greatest and most sensitive equipment. Many EMC issues are easy to detect, and after that you mostly need to monitor if the situation improves or gets worse with various configuration changes. This session introduces the audience to low cost measurement tools, and ones you can make yourself, that can help you tackle EMC problems.

Speaker: Yibo Wang, ETS-Lindgren
Speaker: Zhong Chen, ETS-Lindgren
Location: E&D Booth 4
Time: 10:00 AM – 12:00 PM

Abstract: The Cylindrical Mode Filtered SVSWR (CMF SVSWR) is measured by placing the transmit antenna (typically a low gain omni-directional antenna) at the edge of the turntable and performing a single cut vector pattern measurement. The vector S21 as a function of turntable angle at each frequency is transformed to the spectrum domain, where a filter can be applied to mathematically remove the chamber effects. The SVSWR is derived by comparing the original pattern in the chamber to the “clean” filtered pattern. This CMF SVSWR provides a more comprehensive evaluation of the EMC chamber quiet zone and can be readily measured without any special positioning fixtures. The demonstration will show an entire measurement process including the post processing which can be performed in real time. This new measurement technique is under consideration for the new draft standard ANSI C63.25.3 under development by the ANSC C63® committee for EMC test sites from 18 GHz to 40 GHz.

Sponsored by TC-10
Speaker: Paul Bremner, Robust Physics
Location: E&D Booth 1
Time: 2:00 PM – 4:00 PM

Abstract: Signal Integrity engineers may not realize that small radiation losses on a digital channel can still mean large radiation susceptibility to high levels of electromagnetic interference. Also, digital interconnects are typically installed in bounding enclosures with reverberant electric field conditions, Reverberation creates highly variable EMI levels which can only be predicted statistically – typically with a Min-Max dynamic range of 40 dB or more. So for increasingly high data rates and long digital interconnects on aircraft and automobiles, the EMC engineer becomes an important part of the signal integrity equation. This demo session will use NEW statistical wave physics CO-SIMULATION to model the multple radiation susceptibility paths of a digital interconnect, to predict eye diagrams and bit error rates on the digital interconnect and to interactively simulate signal integrity design solutions with a simple, mesh-free, system-level model that solves to 8/18/40 GHz in typically less than 60 seconds.

Speaker: Michael Schnecker, Rohde & Schwarz
Location: E&D Booth 2
Time: 2:00 PM – 4:00 PM

Abstract: The increasing current levels required by the more powerful processors used in AI systems are pushing the limits of frequency domain methods for measuring impedance and stability. This demonstration will show time-domain methods for analyzing the worst-case voltage ripple under dynamic loading conditions. Included in the demonstration will be measuring PDN noise under dynamic load conditions with 100%-time coverage, power rail crosstalk, evaluating stability, and potential EMI sources.

Sponsored by TC-10
Speaker: Shahid Ahmed, TE Connectivity Corporation
Speaker: Aishah Shahid, Princeton University
Location: E&D Booth 3
Time: 2:00 PM – 4:00 PM

Abstract: Signal Integrity (SI) and Power Integrity (PI) are critical aspects of modern electronic system design. As devices become faster and more complex, the importance of ensuring reliable and efficient signal and power delivery across circuits increases significantly. This proposal aims to demonstrate a computational modeling and characterization framework that integrates cutting-edge simulation techniques for analyzing and improving SI and PI. Through a software demo, we will showcase how these models can predict and resolve common issues such as signal degradation, crosstalk, electromagnetic interference (EMI), and power noise. The proposed demo will provide valuable insights for engineers and researchers seeking to enhance the performance of high-speed and high-frequency systems while adhering to the latest EMC regulations.

Speaker: Ben Hodges, ETS-Lindgren Finland
Speaker: Ethan Swanson, Element Rockford, IL
Location: E&D Booth 4
Time: 2:00 PM – 4:00 PM

Abstract: This demonstration presents a fully automated emissions testing workflow that converts raw electromagnetic interference (EMI) measurement data into a formatted test report in real time. Attendees are encouraged to bring their own hand-held devices—or use provided examples— to perform an emissions measurement. Using predefined measurement parameters, the automated system processes the acquired data, applies limit comparisons, and generates a standardized test report that is immediately printed and delivered to the participant as a physical souvenir.

The objective of this demonstration is to showcase how modern automation techniques can significantly reduce the time and effort traditionally required to move from measurement to documented results in EMC testing. By integrating instrumentation control, data analysis, and report generation into a single workflow, the demonstration highlights opportunities to improve test efficiency, consistency, and repeatability in both laboratory and pre-compliance environments. The walk-up format of the demonstration emphasizes accessibility and real-world applicability.

The presenters represent a commercial EMC test lab principal engineer and a commercial EMC test software engineer who will share their expertise through case-studies highlighting novel applications and efficiencies using automated EMC software.

Sponsored by TC-4
Speaker: Gustavo Perez, Wurth Elektronik eiSos GmbH & Co KG
Location: E&D Booth 1
Time: 10:00 AM – 12:00 PM

Abstract: Accurate impedance characterization of cable ferrites is essential for selecting the appropriate suppression component in electromagnetic compatibility (EMC) applications. However, measurement accuracy can be significantly affected by the test setup, particularly the properties of the cable used during the evaluation. This demonstration investigates how cable length, routing, and associated parasitic capacitance influence impedance measurements of cable ferrites across frequency. Through practical examples, we show how longer cables introduce resonant behaviors that distort the expected impedance profile, potentially leading to incorrect component selection.

In addition, the demo compares the impact of different numbers of turns on the ferrite core and highlights how this interacts with material characteristics. Using samples of various ferrite materials, we examine their complex permeability curves and illustrate how material choice determines suppression performance over frequency. The session aims to provide attendees with a deeper understanding of best practices for reliable ferrite impedance measurements, emphasizing how test setup optimization and material knowledge contribute to achieving consistent and meaningful EMC results.

Sponsored by TC-9
Speaker: Johnny Himbele, Tanager
Speaker: Patrick DeRoy, Analog Devices Inc.
Speaker: Louann Mlekodaj, Shure, Inc.
Location: E&D Booth 2
Time: 10:00 AM – 12:00 PM

Abstract: This Experiments & Demonstrations (E&D) session presents a hands-on PCB measurement workflow using an affordable vector network analyzer (NanoVNA), combined with electromagnetic (EM) simulation-based validation.

Printed circuit board (PCB) test structures will be measured using a NanoVNA, and representative frequency-domain results such as S-parameters will be obtained. Community-based (free) numerical EM simulations of the corresponding configurations will then be used to validate the measured results, highlighting agreement, modeling assumptions, and sources of discrepancy.

Based on this validation, the demonstration will further show how EM simulation can be used to extend analysis beyond what can be practically measured during a live session, providing additional insight into PCB behavior. The session emphasizes the complementary roles of measurement and simulation, with a particular focus on simulation as a tool for validation and future design exploration.

Speaker: Clint Patton, GoEngineer
Location: E&D Booth 3
Time: 10:00 AM – 12:00 PM

Abstract: This demonstration combines simulation and measurement to examine the physics and practical design of near-field sniffer probes. Full-wave electromagnetic simulations are used to illustrate key near-field coupling mechanisms and to guide the design of low-cost, do-it-yourself (DIY) probe geometries. The simulated behavior is correlated with measurements from fabricated probes, and performance is compared with commercially available near-field probes. Techniques for quantifying probe frequency range and for integrating probes with low-noise amplifiers (LNAs) are demonstrated. The session concludes with a live demonstration of optimized probe designs and near-field measurements, reinforcing the connection between simulation, theory, and practice. 

Sponsored by TC-7
Speaker: Victor Martinez Garcia, Wurth Elektronik eiSos GmbH & Co KG
Location: E&D Booth 4
Time: 10:00 AM – 12:00 PM

Abstract: Low‑frequency magnetic interference remains one of the most difficult challenges in modern electronic systems, especially in applications involving Wireless Power Transfer (WPT), NFC, and tightly integrated electronics. Traditional ferrite‑based magnetic absorbers—such as flexible absorber sheets and flexible sintered ferrite sheets—have long been the industry’s workhorses for mitigating magnetic coupling, suppressing resonances, and stabilizing near‑field behavior. Their high permeability and predictable frequency response make them indispensable in many designs, yet they reach intrinsic limits when broader bandwidth, thinner form factors, or stronger low‑frequency suppression are required. 

This experiment introduces a next‑generation nanocrystalline magnetic absorber designed to extend EMI suppression performance into regions where ferrite materials begin to struggle. By leveraging stacked ultra‑thin nanocrystalline layers with exceptionally high permeability and low coercivity, this new material exhibits superior absorption in the low‑frequency domain while avoiding the reflections, detuning effects, and integration constraints commonly encountered with metallic shielding solutions.

The session will present a comparative study between nanocrystalline absorbers and established magnetic absorbers solutions, including permeability behavior, frequency response, mechanical characteristics, and impact on the overall electromagnetic environment. Practical demonstrations will show how these materials perform in real‑world wireless applications, such as an NFC communication setup and a wireless power transfer system, emphasizing how absorber‑based shielding can stabilize resonant circuits without degrading coil efficiency. 

By combining ferrite heritage with nanocrystalline innovation, this work highlights a new path forward in achieving broadband, low‑intrusion EMI control for next‑generation wireless designs.